PRODUCT
CU PELLET
High purity copper pellets designed for vacuum evaporation deposition processes. Copper evaporation materials provide stable vaporization and controlled thin film formation in vacuum coating systems.
PRODUCT OVERVIEW
Copper pellets are commonly used as evaporation materials in vacuum deposition equipment where conductive metal films are required. During evaporation, the copper material is heated until it vaporizes and deposits onto the substrate surface, forming uniform metallic coatings.
Copper thin films are widely used for conductive layers in electronic devices and thin film technologies. High purity copper material supports stable evaporation behavior and consistent coating performance during deposition.
SPECIFICATIONS
Purity: 4N5
Form: Pellet
Dimensions: รธ3ร3 mm, รธ6ร6 mm
Composition: Copper (Cu)
Application: Deposition material used in evaporation equipment
APPLICATIONS
Copper pellets are used in vacuum evaporation systems for depositing conductive thin films onto substrates. These coatings are commonly applied in electronic components, thin film technologies and research deposition systems.
Copper evaporation materials support controlled film growth and stable deposition behavior in laboratory, pilot and industrial thin film coating environments.
CUSTOMIZATION OPTIONS
Copper pellets can be supplied in different pellet sizes depending on the evaporation system and deposition requirements. Pellet dimensions and material specifications can be adapted to match specific vacuum deposition equipment.
Customization options may include variations in pellet geometry or purity level to support optimized evaporation efficiency and coating performance.
TECHNICAL FEATURES
Copper pellets provide predictable evaporation behavior and stable vaporization during vacuum deposition processes. High purity copper helps maintain consistent thin film conductivity and reduces the risk of contamination during coating.
The compact pellet geometry supports efficient material usage and controlled deposition rates, contributing to uniform thin film formation across substrate surfaces.
REQUEST SPECIFICATIONS
Share your material requirements and application details. Our technical team will review your specifications and respond with the appropriate ITO grade or recycling solution.