PRODUCT

AL PELLET

High purity aluminum pellets designed for vacuum evaporation deposition processes. Aluminum evaporation materials provide stable vaporization and controlled thin film formation in vacuum coating systems.

PRODUCT OVERVIEW

Aluminum pellets are commonly used as evaporation materials in vacuum deposition equipment where lightweight conductive metal films are required. During evaporation, aluminum pellets are heated until they vaporize and condense onto substrate surfaces, forming uniform metallic coatings.

Aluminum thin films are widely used in electronic devices, optical coatings and thin film technologies. High purity aluminum material supports stable evaporation behavior and consistent film properties during deposition.

SPECIFICATIONS

Purity: 4N5


Form: Pellet


Dimensions: รธ3ร—3 mm, รธ6ร—6 mm


Composition: Aluminum (Al)


Application: Deposition material used in evaporation equipment

APPLICATIONS

Aluminum pellets are used in vacuum evaporation systems to deposit conductive and reflective metal films. These coatings are commonly applied in electronic components, optical coatings and thin film technologies where controlled metal layer formation is required.

Evaporation processes using aluminum pellets are widely used in laboratory research, pilot coating systems and industrial thin film production environments.

CUSTOMIZATION OPTIONS

Aluminum pellets can be supplied in different pellet sizes depending on the evaporation system and deposition requirements. Pellet dimensions and material specifications may be adjusted to match specific vacuum deposition equipment.

Customization may include variations in pellet geometry or purity level to optimize evaporation efficiency and coating performance.

TECHNICAL FEATURES

Aluminum pellets provide stable vaporization and predictable evaporation behavior during vacuum deposition processes. High purity aluminum supports consistent thin film formation and minimizes contamination during coating operations.

The compact pellet geometry allows efficient material utilization and controlled evaporation rates, supporting uniform thin film coatings across substrate surfaces.

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