PRODUCT
AL TARGET
High purity aluminum sputtering targets designed for semiconductor wafer deposition. Built for stable thin film growth and repeatable performance in 300 mm wafer manufacturing environments.
PRODUCT OVERVIEW
Aluminum targets are widely used in semiconductor deposition processes where conductivity, uniformity and process stability are essential. In wafer manufacturing, aluminum thin films are commonly applied in metal layer deposition workflows requiring consistent film properties across large substrates.
Designed for 300 mm wafer systems, aluminum targets support stable sputtering behavior and predictable material transfer. High purity material helps reduce contamination risk and supports reliable process control in high-throughput production.
SPECIFICATIONS
Purity: 4N5
Form: Sputtering target
Dimensions: For รธ300 mm wafer
Composition: Aluminum (Al)
Application: Al deposition for 300 mm wafer
APPLICATIONS
Aluminum sputtering targets are used in semiconductor wafer deposition where controlled film thickness and electrical performance are required. In 300 mm wafer lines, stable deposition and consistent target behavior support repeatable results across production runs.
Aluminum films are typically used in processes where conductive metal layers and uniform coatings are needed for advanced microelectronics manufacturing.
CUSTOMIZATION OPTIONS
Aluminum targets can be supplied to match specific sputtering tool configurations and process requirements. Target dimensions and mounting or bonding configurations can be customized depending on equipment design and deposition conditions.
Material specifications can also be aligned with contamination control needs in semiconductor manufacturing environments.
TECHNICAL FEATURES
Aluminum targets provide stable plasma interaction and predictable erosion behavior during sputtering. High purity aluminum supports low contamination risk and consistent deposition performance, which is essential for process stability in semiconductor production.
Consistent target quality contributes to uniform thin film thickness and reliable coating performance across 300 mm wafer substrates.
REQUEST SPECIFICATIONS
Share your material requirements and application details. Our technical team will review your specifications and respond with the appropriate ITO grade or recycling solution.